Author: Asianet Pakistan

ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

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ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

Read More

ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

Read More

ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

Read More

ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

Read More

Bodor Laser Marks 10,000-Machine Milestone, Turning Manufacturing Scale into Customer Value

Asianet Pakistan

JINAN, China, Sept. 29, 2026 (GLOBE NEWSWIRE) — Bodor Laser has reached a new production milestone, with its 10,000th machine of 2026 officially rolling off the production line. The milestone reflects the continued expansion of Bodor’s manufacturing capacity and its ability to coordinate production, quality control, delivery and customer support as its global installed base […]

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Bodor Laser Marks 10,000-Machine Milestone, Turning Manufacturing Scale into Customer Value

Asianet Pakistan

JINAN, China, Sept. 29, 2026 (GLOBE NEWSWIRE) — Bodor Laser has reached a new production milestone, with its 10,000th machine of 2026 officially rolling off the production line. The milestone reflects the continued expansion of Bodor’s manufacturing capacity and its ability to coordinate production, quality control, delivery and customer support as its global installed base […]

Read More

Bodor Laser Marks 10,000-Machine Milestone, Turning Manufacturing Scale into Customer Value

Asianet Pakistan

JINAN, China, Sept. 29, 2026 (GLOBE NEWSWIRE) — Bodor Laser has reached a new production milestone, with its 10,000th machine of 2026 officially rolling off the production line. The milestone reflects the continued expansion of Bodor’s manufacturing capacity and its ability to coordinate production, quality control, delivery and customer support as its global installed base […]

Read More