Category: English

ProductLife Group completes its transformation into a single, unified group with an end-to-end set of human and digital capabilities across life sciences

Asianet Pakistan

The consolidation of 26 businesses, acquired over six years, into one identity — now expressed through a new brand: PLG | Advanced Intelligence for Life Sciences PLG | Advanced Intelligence for Life Sciences   PARIS, Sept. 29, 2026 (GLOBE NEWSWIRE) — ProductLife Group (PLG) today completes a multi-year transformation, uniting the 26 businesses it has […]

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ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

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ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

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ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

Read More

ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

Asianet Pakistan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first […]

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