Category: MENA

AUSTIN, Texas, March 04, 2025 (GLOBE NEWSWIRE) — Ambiq^®, a leading provider of ultra-low-power semiconductor solutions that address the significant power consumption challenges of conventional and AI compute at the edge, unveils the Apollo330 Plus System-on-Chip (SoC) series. The series consists of the base Apollo330 Plus, the Apollo330B Plus, and the Apollo330M Plus, each offering a rich set of peripherals and connectivity options for healthcare, smart homes and buildings, industrial edge applications, and more to drive always-on and real-time AI at the edge.

Key Features:

• Up to 250 MHz Arm^® Cortex ^®-M55 application processor with turboSPOT^® and Arm^® Helium technology
• 48/96 MHz Arm Cortex-M4F network processor and multi-protocol radio (in wireless product options)
• Over 16x faster performance and lower latency, and 30x better AI energy efficiency than similar solutions based on previous generation Cortex-M processors
• Ultra-low power digital microphone PDM for truly always-on voice
• Multiple package and connectivity options such as Bluetooth^® Low Energy, Matter, and Thread for diverse edge devices

The Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices. Built on Ambiq’s proprietary subthreshold power optimized technology (SPOT^®) platform, it achieves unprecedented 16x faster performance and up to 30x better AI energy efficiency compared to similar solutions based on previous generation Cortex-M processors, so manufacturers can deliver innovative features while extending device lifetimes, offering multi-protocol connectivity across diverse endpoints, and enhancing user experiences.

The Apollo330 Plus architecture fully leverages the Arm Cortex-M55 processor with Arm Helium technology for AI acceleration, processing up to 8 MACs per cycle. The Apollo330 Plus series includes 2MB of on-chip system RAM, 2MB of embedded non-volatile memory, a large 32kB I-cache and 32kB D-cache on a wide bus, and a multi-protocol radio for developers to create high-performing and power-efficient products.

“While today’s smart devices rely heavily on power-hungry cloud computing, the Apollo330 Plus series creates a brand-new opportunity by enabling true edge AI processing,” says Fumihide Esaka, CEO of Ambiq. “This empowers manufacturers to create longer-lasting, more responsive, intelligent devices for homes, offices, and factories.”

“With a growing number of new and compelling edge AI applications emerging across markets including industrial and smart home, enabling ultra-low-power AI processing directly at the edge will be transformative,” said Laurence Bryant, VP segment marketing, IoT Line of Business at Arm. “With this new solution, built on Arm, Ambiq is paving the way for smarter, more efficient devices that can deliver real-time intelligence across a wide range of use cases.”

The Apollo330 Plus series offers three variants:

• The Apollo330 Plus base model without wireless connectivity offers a rich set of peripherals for wearables, medical/healthcare, and smart home, empowering developers to create sophisticated sensor-based applications easily.
• The Apollo330B Plus extends upon the Apollo330 Plus with Bluetooth^® Low Energy (BLE) support for a wide selection of connected peripherals and audio applications
• The Apollo330M Plus further adds multi-protocol radio support for IEEE 802.15.4, Thread, and Matter, enabling low-power interoperability mesh networking between next-gen smart home, smart meter, and industrial edge devices

Its streamlined multi-core architecture comprises a powerful application processor and a dedicated network co-processor for uncompromised radio performance. The design simplifies development while delivering uncompromised multi-protocol radio performance with robust signal strength up to +14dBm signal strength and enhanced radio sensitivity.

Innovative secureSPOT^® 3.0 features based on Arm TrustZone^® technology further enhance Apollo330 Plus Series SoCs, ensuring the integrity and confidentiality of data transmitted and processed by connected devices. With hardware-based security mechanisms, such as secure boot and secure firmware updates, these SoCs provide robust protection against unauthorized access and malicious attacks, enabling secure deployment in various applications.

As the newest addition to Ambiq’s portfolio, the Apollo330 Plus SoC series sets a new standard for ultra-low-power AI processing at the edge. With more connectivity, security, a wider set of peripheral interfaces, and multiple package options, these SoCs provide developers with the tools they need to implement sophisticated, energy-efficient AI solutions in edge devices.

Check out the Apollo330 Plus SoC Series, and visit Ambiq at Embedded World 2025 by booking a meeting with their team.

About Ambiq

Our mission is to enable intelligence (artificial intelligence (AI) and beyond) everywhere by delivering the lowest power semiconductor solutions. We enable our customers to deliver artificial intelligence compute at the edge where power consumption challenges are the most profound. Our technology innovations, built on the patented and proprietary subthreshold power optimized technology (SPOT), fundamentally deliver a multi-fold improvement in power consumption over traditional semiconductor designs. We’ve powered over 260 million devices today. For more information, visit www.ambiq.com.

Contact

Charlene Wan
VP of Branding, Marketing, and Investor Relations
[email protected]
+1.512.879.2850

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/caa4645a-4944-4bf7-b13b-0a3177b7d62c

GlobeNewswire Distribution ID 9388378

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

• Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
• Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

• Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android.
• Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

• Qualcomm Spectra ISP, Qualcomm® Adreno GPU, and Qualcomm® Hexagon DSP
• 5^th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
• Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

• Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
• Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

• Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android.
• Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

• Qualcomm Spectra ISP, Qualcomm® Adreno GPU, and Qualcomm® Hexagon DSP
• 5^th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
• Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

• Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
• Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

• Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android.
• Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

• Qualcomm Spectra ISP, Qualcomm® Adreno GPU, and Qualcomm® Hexagon DSP
• 5^th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
• Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

• Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
• Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

• Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android.
• Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

• Qualcomm Spectra ISP, Qualcomm® Adreno GPU, and Qualcomm® Hexagon DSP
• 5^th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
• Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

• Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
• Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

• Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android.
• Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

• Qualcomm Spectra ISP, Qualcomm® Adreno GPU, and Qualcomm® Hexagon DSP
• 5^th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
• Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468