Category: Pakistan

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Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q™ System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism™ embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing™ QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

  • Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
  • Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron™ dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

  • Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android™.
  • Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

  • Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP
  • 5th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
  • Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

Posted on

Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q™ System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism™ embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing™ QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

  • Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
  • Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron™ dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

  • Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android™.
  • Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

  • Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP
  • 5th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
  • Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

Posted on

Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q™ System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism™ embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing™ QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

  • Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
  • Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron™ dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

  • Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android™.
  • Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

  • Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP
  • 5th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
  • Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

Posted on

Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration

Advanced Open-Q SoMs Accelerate AI-Powered Visual Navigation in Drones, Robotics and Surveillance Applications

IRVINE, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Lantronix Inc.  (NASDAQ: LTRX), a global leader of compute and connectivity for IoT solutions enabling AI Edge Intelligence, today announced a breakthrough in AI-powered camera technology with the seamless integration of its high-performance Open-Q™ System-on-Module (SoM) solutions including hardware and software with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism™ embedded software. This integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance and robotics.

Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing™ QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging and real-time decision-making. Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight- and power-optimized (SWaP) AI camera solutions that push the boundaries of innovation.

Lantronix at the Forefront of AI Edge Intelligence

“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability and continuous innovation,” said Mathi Gurusamy, Chief Strategy Officer at Lantronix. “By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximizes performance while simplifying development and deployment,” he added.

Advanced AI and Thermal Processing

Lantronix’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices. Key features include:

  • Prism ISP: Super resolution, turbulence mitigation, atmospheric obscurant correction, de-noising, image fusion, electronic stabilization, and local contrast enhancement.
  • Prism AI: Real-time object detection, motion target indication, and high-speed target tracking at video frame rates.

Lantronix’s Open-Q SoMs fully support Teledyne FLIR Hadron™ dual visible-thermal and Boson® thermal camera modules, allowing for simultaneous color and infrared video capture across multiple MIPI-CSI camera interfaces. Key configurations include:

  • Hadron Camera: Integrated with the Lantronix Open-Q 8250 SoM, featuring the Dragonwing QCS8250 processor running Android™.
  • Boson Camera: Integrated with the Lantronix ultra-compact Open-Q 5165 SoM, leveraging the Dragonwing QRB5165 platform on Linux®.

Teledyne FLIR on the Lantronix Collaboration

“Our collaboration with Lantronix adds flexibility for integrators developing thermal-enabled AI-based platforms,” said Michael Walters, Vice President of Product Management at Teledyne FLIR OEM. “Our SWaP-optimized IR camera modules and ultra-low embedded software processing power simplify thermal management and extend battery life for autonomy applications.”

Lantronix Open-Q 5165: Optimized for AI and Edge Computing

Lantronix’s Open-Q 5165 is an ultra-compact (50mm x 29mm), production-ready, pre-certified SoM based on the powerful Dragonwing QRB5165 platform. Features include:

  • Qualcomm Spectra™ ISP, Qualcomm® Adreno™ GPU, and Qualcomm® Hexagon™ DSP
  • 5th generation Qualcomm® AI Engine, with twice the performance of the previous generation, with up to 15 trillion operations per second
  • Wi-Fi 6 connectivity, advanced camera features and many high-speed interfaces

Lantronix will display its SoMs in the Qualcomm Technologies booth at Hall5/5-161 at Embedded World, March 13–15, 2025, in Nuremberg, Germany.

About Lantronix

Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth markets, including Smart Cities, Enterprise and Transportation. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that enable AI Edge Intelligence. Lantronix’s advanced solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.

For more information, visit the Lantronix website.

Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
[email protected]

Lantronix Analyst and Investor Contact:
[email protected]

©2025 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm, Qualcomm Dragonwing, Qualcomm Spectra, Snapdragon, Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.

GlobeNewswire Distribution ID 9387468

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Dauphine University Students Win Denodo University Challenge

Team delivers winning logical data management solution in support of improving life expectancy

PALO ALTO, Calif., March 04, 2025 (GLOBE NEWSWIRE) — Denodo, a leader in data management, announced that the winner of the latest Denodo University Challenge, Data for Social Change: Improve Life Expectancy, is the Data Shoe team from Dauphine University, in Paris, France, with members Dounia Bouloudene (captain), Nassim Fatmi, and Youcef Azouaoui (The page hyperlinked above includes a video, supplied by Data Shoe, that showcases the winning solution). Additionally, the Universidade da A Coruña, in Spain, was awarded a prize for contributing the most teams to this competition.

The Denodo Academic Program prepares students through virtual, self-paced training modules, live workshops, and a free version of the Denodo Platform. The latest University Challenge, announced in September of last year, put teams of students through the paces as they raced to build the most effective solution for leveraging data and analytics to improve ESG practices and ultimately life expectancy.

The Data for Social Change: Improve Life Expectancy challenge required students to integrate views of data sources, both supplied and student-identified, to correlate life expectancy with a variety of factors and draw conclusions. The challenge required students to analyze the data using reporting and/or visualization tools and build graphs and other representations to present their findings.

The winning team, Data Shoe, demonstrated that improving healthcare access, reducing air pollution, and fostering political stability are critical to the improvement of life expectancy, and that advancing public policies in these areas can drive not only significant social progress, but also better quality of life, globally. To solve this Challenge, the Data Shoe team identified, accessed, and integrated publicly available data related to air pollution and political stability.

The judges also determined that Data Shoe did an excellent job of explaining the metadata created in the Denodo Platform using the Denodo Design Studio and providing a clear narrative in their Microsoft Power BI report, along with easy-to-understand visuals. The team’s conclusions were well supported by their analysis.

Dounia spoke for the whole team when she said, “The Denodo University Challenge taught us how to think strategically about solving complex data integration problems by efficiently using the Denodo Platform, with the aim of retrieving relevant insights from raw data. Our biggest challenges were choosing the best way to optimize our approach and finding the most valuable data sources, but teamwork and perseverance allowed us to overcome them.”

“I was extremely proud of the level of professionalism that the Data Shoe team brought to this competition,” said Alberto Pan, chief technology officer at Denodo. “Working together, they demonstrated the importance of good data, enhanced through a semantic layer, to answer questions about longevity in a clear, defensible way. The Denodo Platform’s logical data management capabilities, such as support for low code/no code development, makes it easy for students and those without extensive data management experience to rapidly learn the platform and develop solutions. The Data Shoe team leveraged these capabilities to quickly build a robust, well-designed solution.”

The next Denodo University Challenge, focused on AI, is open for pre-registration starting today.

Media Contacts
[email protected]

About Denodo
Denodo is a leader in data management. The award-winning Denodo Platform is the leading logical data management platform for delivering data in the language of business, at the speed of business, for all data-related initiatives across the organization. Realizing more than 400% ROI and millions of dollars in benefits, Denodo’s customers across enterprises in 30+ industries all over the world have received payback in less than six months. For more information, visit denodo.com.

GlobeNewswire Distribution ID 9388502

Posted on

Temp Connect Goes Global: Transforming the Workforce for Employers and Job Seekers

With a mission to revolutionize the staffing industry, Temp Connect launches globally, offering innovative solutions for a modern workforce

DENVER, March 04, 2025 (GLOBE NEWSWIRE) — Temp Connect, a groundbreaking platform designed to redefine staffing, proudly announces its global launch. Temp Connect bridges the gap between employers and job seekers, creating a streamlined hiring process for temporary and permanent roles worldwide, emphasizing efficiency and transparency.

Driving Global Impact:

As the job market evolves with more remote work, gig opportunities, and global hiring, Temp Connect provides a seamless and adaptable platform that simplifies the hiring process for employers and job seekers alike.

By eliminating barriers that have long hindered traditional staffing practices, Temp Connect empowers businesses to connect with talent pools while providing job seekers with more significant opportunities.

Innovative Features:

Temp Connect stands out with its user-friendly design and cutting-edge technology, offering a seamless experience for both employers and job seekers:

  • Flexible and Affordable Job Postings: Employers receive one free job posting and can choose from cost-effective plans tailored to their hiring needs.
  • 30-Day Job Listings: Every job post remains active for a month, maximizing visibility and increasing the chances of finding the right match.
  • Instant Job Matching: Advanced algorithms quickly connect employers with qualified candidates, reducing hiring time.
  • Real-Time Notifications: Job seekers receive instant alerts about new opportunities, ensuring they never miss a potential job.
  • Time Clock Manager: An integrated time-tracking system helps businesses manage temporary workers efficiently, simplifying payroll and timekeeping.
  • User-Friendly Dashboard: Employers and job seekers can easily manage applications, job postings, and connections through an intuitive interface.

These features make hiring and job searching faster, more innovative, and more efficient, creating meaningful connections across industries and regions.

The Vision Behind Temp Connect:

Temp Connect’s foundation lies in its mission to revolutionize the staffing industry. Inspired by personal experiences in the workforce, founder Christina Smith created the platform to address inefficiencies and unfair practices in traditional staffing.

“Temp Connect is about more than just finding jobs or hiring talent—it’s about building a system that works for everyone,” Christina explains. “We aim to bring the same transformative change to staffing as Uber and Lyft did to ridesharing.”

Milestones and Growth:

Since its inception, Temp Connect has grown from a bold idea to a global platform, connecting thousands of employers and job seekers. This global launch represents a significant milestone in the company’s journey, marking the beginning of an era where technology redefines the workforce.

Temp Connect invites employers and job seekers to join the movement and experience a better way to connect and work. Visit www.tempconnect.app to learn more about the platform and its features.

Temp Connect isn’t just changing the staffing industry—it’s shaping the future of work. With a commitment to innovation, accessibility, and efficiency, Temp Connect redefines how the world connects and works.

Temp Connect is a global workforce platform revolutionizing how businesses hire, and job seekers find work. Designed for speed, efficiency, and accessibility, Temp Connect streamlines the hiring process with flexible job postings, real-time job matching, and built-in time tracking. By eliminating traditional staffing barriers, the platform empowers businesses to connect with qualified talent faster and helps workers access more job opportunities. Whether for temporary, gig, or permanent roles, Temp Connect is shaping the future of staffing.

Learn more at www.tempconnect.app.

Media Contact:

Christina Smith, Founder
(303) 667-7379
[email protected]

GlobeNewswire Distribution ID 9385720